Business
Probe Card
| Item | Capability |
|---|---|
| Probes (Max.) | Over 6,000pins |
| Min. pad pitch | 65um |
| Min. pad size | 60x60um |
| Max. PCB size | Φ440mm (Advantest), Φ480mm |
| Available pad configuration | 32para (8x4, 16x2), 64para (8x8, 16x4), 96para (16x6), 128para (16x8) |
| Test temp. | -20~125℃ |
| Device | DRAM, SDRAM, DDR, Nand FLASH |
| Delivery 3000Pin/64Para |
First : 28 day (Start from PCB Design) |
| Repeat : 19 day |
| Item | Capability | ||
|---|---|---|---|
| DDI | SOC | CIS | |
| Product |  |
 |
 |
| Probes (Max.) | Over 3,000pins | Over 1,500pins | Over 1,500pins |
| Min. pad pitch | 23um (In-line) | 42um | 80um |
| 14 / 28um (Staggered) | |||
| Min. pad size | 13 x 55um | 36x66um | 65x65um |
| PCB size | ~Φ350mm | ~Φ300mm | ~Φ440mm (Magnum ICP) |
| Parallel | 1x1, 2x1,2x2 | 1x1, 2x1,2x2, Dual 2x2 | 16x1, 32x1 |
| Test Frequency | <800MHz | <450MHz | <200MHz |
| Tester | TS6700, T6371/2/3, ST6730(A), D750EX |
V93K, Flex, Catalyst and etc. |
Magnum ICP, IP750EX |
| Delivery | 1,000Pin/ Single | 800Pin/4Para | 1,600Pin/16Para |
| First : 21 day (Start from PCB Design) |
First : 20 day (Start from PCB Design) |
First : 24 day (Start from PCB Design) |
|
| Repeat : 8 day | Repeat : 7 day | Repeat : 9 day | |
| Item | DDI | SOC | CIS |
|---|---|---|---|
| Pad Size | >13㎛X 55㎛ | >36㎛X 66㎛ | >65㎛X 65㎛ |
| Pad Pitch (Fine Pitch) |
>Stagger : 14㎛ | >42㎛ | >80㎛ |
| >In-line : 23㎛ | |||
| Probe Area (Chip Size) |
15,260㎛X 620㎛ | 4,420㎛X 4,420㎛ | 5,550㎛X 5,160㎛ |
| X, Y Accuracy | <±2㎛ | <±3㎛ | <±3㎛ |
| Tip Planarity | <MAX.10㎛(0.4mils) | <MAX.10㎛(0.4mils) | <MAX.10㎛(0.4mils) |
| Tip Size | 7±1㎛ | 14±2㎛ | 18±2㎛ |
| Over Drive | <25㎛ | <50㎛ | <50㎛ |
| Scrub Mark Size (Total Scrub) |
>15㎛ | >30㎛ | >38㎛ |
| Frequency | <800MHz | <450MHz | <200MHz |
| Temperature | -20˚C ~ 125˚C | -20˚C ~ 125˚C | -20˚C ~ 125˚C |
| Contact Resistance | 3Ω | 3Ω | 3Ω |
| Contact Life | <1,000K TDs | <500K TDs | <500K TDs |
